The semiconductor manufacturing process demands extreme precision in material processing, particularly for quartz components used in wafer handling and lithography systems. High-precision quartz milling machines have become indispensable tools for achieving the sub-micron level accuracy required in modern fabs.
| Parameter | Industry Standard | Advanced Requirement |
|---|---|---|
| Surface Roughness (Ra) | ≤0.4μm | ≤0.1μm |
| Dimensional Tolerance | ±5μm | ±1μm |
| Flatness | 5μm/100mm | 1μm/100mm |
Quartz (SiO₂) presents unique machining challenges due to its high hardness (Mohs 7) and brittle nature. Conventional milling techniques often cause micro-cracks and subsurface damage that compromise component performance in critical semiconductor applications.
Our SCM Ultrafine Mill series incorporates single-crystal diamond tooling with proprietary edge preparation that achieves surface finishes below 0.08μm Ra. The system’s active vibration damping maintains tool-workpiece contact stability even at spindle speeds exceeding 40,000 RPM.
| Model | Max RPM | Positioning Accuracy | Surface Finish (Ra) |
|---|---|---|---|
| SCM800 | 45,000 | ±0.5μm | 0.05-0.1μm |
| SCM1000 | 60,000 | ±0.3μm | 0.03-0.08μm |
The MTW Series Trapezium Mill features our patented thermal compensation architecture that maintains machine geometry within 0.1μm/°C. Liquid-cooled spindle housings and granite reference surfaces ensure consistent performance across 24/7 production cycles.
Modern quartz milling systems must integrate seamlessly with semiconductor cleanroom protocols. Our solutions include:
Our MTW175G model achieved breakthrough results in machining extreme ultraviolet lithography mirrors, demonstrating:
Emerging requirements for 2nm node technologies are driving innovations in:
